PCB应用

低压注塑成型(LPM)是NORD提供电子组件最新的环保封装工艺,其较低的注射压力不会伤害敏感电子元器件。可以通过模具对电路板进行局部或完全封装,被包胶的区域与外界隔离:防水防尘、抗冲击、耐高低温、耐溶剂、防火阻燃...等。保证电子元器件在不同环境下稳定运行。我们称之为电子木乃伊工艺。
PCB over low temperature molding
PCB over low temperature molding
PCB over low temperature molding
Wire circle over mold by low pressure
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
Low Pressure Molding
pcb-over-moulding-solution2017
Low Pressure Molding
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
热传感器
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
FPC柔性线路板
FPC柔性线路板
FPC柔性线路板
FPC柔性线路板
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION
P.C.B.OVER-MOULDING-SOLUTION